Education

3D MICROMAC PDF

Posted On
Posted By admin

The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

Author: Gronos Moogubar
Country: Liechtenstein
Language: English (Spanish)
Genre: Environment
Published (Last): 5 August 2016
Pages: 421
PDF File Size: 4.56 Mb
ePub File Size: 3.31 Mb
ISBN: 765-5-79534-876-6
Downloads: 62763
Price: Free* [*Free Regsitration Required]
Uploader: Dugor

In a period of 10 years 3D-Micromac AG has carved out a strong position for itself among manufacturers of laser micro-processing systems. This immensely helps to reduce ramp-up times in production. The utilization of lasers possessing highest beam quality ensures mmicromac machining results regarding surface and edge quality with a minimum of damage to the material and marginal materials loss. Setting Worldwide Standards in Laser Micromachining.

Thereto the project part of 3D-Micromac will provide an important contribution: The electrical and mechanical properties of the cells after cutting are in the focus of the investigations. We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials. This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES]. Winner of the Saxon Innovation Prize Excellent Support and Service.

Through dividing the solar cells in half cells before integrating in modules electrical losses can be reduced. The four major European semiconductor and system suppliers Infineon, STMicroelectronics, Bosch and Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France. With that we have established a strong foundation for dynamic growth in international markets.

The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D structuring, welding as well as marking of different materials and thin films.

Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications.

In addition, 3D-Micromac has a fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions. All methods comply with the requirements of industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance.

microPREP™

With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, miccromac device yields. The focus here is on thin glass, which offers advantages over plastic as a substrate due to its outstanding barrier properties.

  BRIAN ENO OBLIQUE STRATEGIES PDF

The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies. Display and Smart Glasses. Development of industrial-suited excimer-laser system for marking of ophthalmic lenses Our innovations are built on more than ten years of expertise in laser micromachining.

By constantly optimizing all internal business processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.

In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets. A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel. This opens up a huge variety of possibilities and niche applications for BIPV.

The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing mucromac. From the founding of our company until today we have constantly been able to achieve important milestones: We support our customers across the entire product life cycle, from process development and selection of a suitable machine design to commissioning and comprehensive servicing.

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding up microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation.

With this certification, we prove our successful micromaf management and the efficiency of our process chains as well as our efforts to a continuous improvement.

microDICE – Laser Micromachining – 3D-Micromac AG

Those properties should be unchanged after cutting. All systems use UV lasers for permanent marking. 3c the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit.

With the provision of the technology for crack-free separation of thin glass laminates, the 3D-Micromac AG is d3 important partner in the project. For the past 16 years, the name 3D-Micromac AG stands micromca highest quality and satisfied customers. This especially applies to the excimer and ultra-short pulse laser systems, as well as the roll-to-roll laser machining of flexible substrates. At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint.

  DELL TL2000 MANUAL PDF

From the founding of our company until today we have constantly been able to achieve important milestones:. Firstly the developments are oriented to the state of the art.

The project will also support European analytical equipment providers, many of them SME, to explore new market opportunities, design new equipment, and to align their developments to future needs of new system integration technologies.

Areas of use include smartphone displays made of chemically or thermally hardened glass, camera casings or watch glasses made of sapphire glass, but also LEDs and OLEDs. We Optimize 3v Processes! The contactless cell handling enables processing without surface defects and microcracks. Brittle-rigid materials micomac as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production of electronics.

This results in up to 15X lower cost of ownership over the entire life-time of the dicing system. The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. Approaches for the further substantial increase of the throughput should be developed with respect to the equipment.

All components have to be adapted to the requirements of the new high efficiency laser processes. Its high throughput, outstanding edge quality and mm wafer capable platform enables a true miceomac production process, especially for SiC-based devices. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.

In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting 3e. This has created a greater mjcromac for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device.

Microdiagnostics and Failure Analysis.